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CALL FOR ABSTRACTS IS OPEN!

Submission Deadline: March 1, 2023

SEMICON West includes 2-3 dedicated sessions to market dynamics & technical Innovations in electronic materials—from wafers to test and assembly. We invite individuals and organizations to submit abstracts and propose presentations of interest to our attendees from end-use electronics and component suppliers, device manufacturers, chip equipment manufacturers, suppliers of services, and other organizations from the electronics ecosystem. 

Note: Purely technical presentations should include: Insights on the impact of the development upon the market or economics of product manufacturing or availability. 

Materials Program Info:

  • 2-3 Sessions: Tuesday, July 10, and Wednesday, July 11

  • Submissions may be referred for consideration for other sessions at SEMICON West. 
     

TOPIC AREAS

ELECTRONIC MATERIALS TECHNICAL, BUSINESS OR MARKET TOPICS  

  • Dynamics shaping the materials market 

  • Hot topics for materials suppliers doing business in the semiconductor industry 

  • Developments in Using and Testing Electronics Materials

    • Lower resistive materials  

    • Higher K materials 

    • Better channel materials 

    • Inter metallic dielectrics 

    • Highly mobility materials 

  • Materials Processing Technology Breakthroughs 

    • Coaters 

    • Process chemicals and gases 

    • Metallizers 

    • Cleaning 

    • Ultra-pure water  

    • Purity and quality control 

  • Impact of Sustainability—Alternative Solutions and Processes 

    • Changes to the materials  

    • Materials handling updates 

    • Organic materials 

    • Nanomaterials 

  • Other Consumables 

 

SUBSTRATES FOR SEMICONDUCTORS, MEMS, SENSORS, and MORE

  • Advanced Substrate Technology Breakthroughs & Developments by Market 

    • Optical, RF, and power customer needs 

    • Logic & AI demands  

    • Memory demands  

    • MEMs and sensor demands  

    • Photonics substrates needs 

    • Other 

  • Quality & Engineering Standards 

  • Sustainability 

  • Processing  

  • Other topics pertaining to wafers 

 

QUESTIONS?

Heidi Hoffman
[email protected]
+1.408.943.7954

Abstracts Due March 1, 2023