Join us at the SEMIEXPO Heartland Manufacturing Forum to explore the cutting-edge manufacturing innovations driving IC-powered vehicles.
Discover how digital twins are optimizing automotive manufacturing to realize the vision of lights-out factories, how sensor-driven automation is transforming the shop floor, and how the new wave of automotive chiplets and advanced packaging is revolutionizing vehicle electronics.
Industry leaders in innovation and operations will share real-world case studies from the trenches—along with their vision for how physical AI and AI-driven processes will reshape automotive manufacturing. Secure your spot as we push the manufacturing envelope even further!
Explore the Sessions
SESSION 1—PACKAGING LEADERSHIP SESSION – VISION FOR THE FUTURE OF ADVANCED MANUFACTURING
Come hear advanced packaging CEOs and technical leaders “look over the horizon” and share what they see in the next phase of evolution of advanced packaging, new substrates, new structures and next gen manufacturing methods. Look at customer demands from AI, HPC, networking, and mobility, the speakers will examine how chiplet ecosystems, 2.5D/3D integration, copackaged optics, and glass/panel substrates will reshape design rules, cost structures, and supply chains over the next decade. Their presentations will highlight which technology inflections (hybrid bonding, HBM4 and beyond, silicon photonics, standardized chiplet interfaces) are likely to reach broad deployment, what new bottlenecks will emerge in thermals, reliability, and substrates. They will portray a vision for a longterm roadmap for advanced packaging.
SESSION 2—MODULAR CHIPLET ARCHITECTURES: USING AI & METROLOGY TO IMPROVE YIELD & COST IN HIGH VOLUME MANUFACTURING
Modular chiplet-based architectures and multi-die integration magnify the impact of small yield losses, reshaping traditional backend cost and capacity assumptions. This session examines how cumulative yield across chiplets, interposers, and advanced processes such as hybrid bonding and fine-pitch RDL drives overall cost, cycle time, and scalability in heterogeneous systems. Speakers will explore known good die (KGD) strategies and inline test and inspection approaches tailored to multivendor chiplet assemblies, highlighting how AI-driven analytics and advanced metrology are becoming critical enablers for these new modular architectures.
SESSION 3—THERMAL MANAGEMENT & POWER DELIVERY IN ADVANCED PACKAGING: FROM TIMS TO WARPAGE CONTROL
Thermal limits and thermo‑mechanical behavior are now first‑order constraints in advanced packaging, directly shaping performance, yield, reliability, and cost. This session explores how material stacks, thermal interface materials (TIMs), process sequences, and temperature excursions drive heat flow and warpage in fan‑out, wafer‑level, and 2.5D/3D packages, and how these effects effect assembly yield and field reliability. Speakers will highlight advanced cooling architectures, optimized TIM integration, backside power‑delivery co‑design, and thermal analysis techniques to meet the ever‑growing thermal challenges of today’s advanced device and packaging trends.
SESSION 4—SECURING THE ADVANCED PACKAGING SUPPLY CHAIN: RE-SHORING, TRACEABILITY, AND INVENTORY INTEGRITY
Rising demand for AI, HPC, networking, and high‑bandwidth consumer devices is exposing fragility in the advanced packaging supply chain, from substrates and interposers to OSAT capacity. This session focuses on supply chain resilience and reshoring: how regionalization and onshoring initiatives are reshaping where advanced packaging is done, who the critical suppliers are, and how risk, cost, and time‑to‑market are being rebalanced. Speakers will address end‑to‑end traceability and supply chain integrity for multi‑die and chiplet-based systems—covering authenticated chains of custody, serialization and tracking, and “trusted” supplier networks to manage inventory leakage and maintain confidence in component provenance.