Dry Resist Technology for Improved EUV Patterning

Addressing critical needs for next-generation device scaling, Lam pioneers a new dry photoresist technology that offers significant improvement in EUV lithography resolution, productivity and yield. As chipmakers move to advanced technology nodes, they are challenged to resolve ever finer features. With this new technology, Lam expands its patterning solutions portfolio, co-optimizing the patterning process from resist application and stack deposition through final etching and cleaning.