New Design and Testing Challenges in Flexible Electronics

Bayflex Solutions in collaboration with the largest branded consumer electronics companies has been developing reliability test (especially mechanical deforming stress) systems specifically for various flexible devices in flexible display devices, medical and automobile applications. Reliability data and test protocols are critical to the product design process which are influenced by test levels, duration, and various environmental acceleration factors. All flexible electronics components, require long-run repeatable mechanical deformation testing such as flexing in hostile conditions to determine failure analysis used to assess new failure modes such as delamination, buckling, and contact failures. Previously engineers used universal testers which only measured the physical limits of material properties, e.g., until it broke; or engineers build their own tools which were not adequate for mechanical precision, the long cycle runs nor scalability across different organizations. Since 2016, Bayflex Solutions has worked with many branded devices and their supply chains. In this session, we will cover the various specific testing challenges and insights such as various mechanical testing, optical imaging software, and hostile environments, gained from developments in designing the latest products.