Advanced Packaging Architectures: Opportunities and Challenges

Advanced packaging architectures are today widely acknowledged as being increasingly important to drive performance and cost improvements of microelectronics systems. As a result, several innovative packaging architectures have been announced in recent years. On-package integration provides a compact, power efficient platform for Heterogeneous Integration of diverse IP that support faster time to market and cost/yield benefits. In this talk, I will describe current technology envelopes and future scaling directions for representative advanced packaging architectures. Key areas of focus will be (1) interconnect scaling, (2) power efficient high bandwidth signaling including optical interconnects, (3) Hybrid Bonding, (4) test challenges for chiplets/die block assembly, and (5) advanced power delivery technologies.