Panel Introduction and Presentations
Presentations
- Heterogenous Integration of Chiplets & SiP—A Balancing Act | Thomas To, Xilinx
Featured Speakers
Vice President, and Head of Chief Innovation Office Synopsys
Specific Architecture Project Lead Open Compute Project Foundation (OCP)
Distinguished Engineer Xilinx
Deputy Director, Advanced Manufacturing National Program Office NIST
Co-Chair, Heterogeneous Integration Roadmap & CEO Third Millennium Test Solutions
Corporate Vice President, Director of Substrate Packaging Technology Development Intel
