ML/AI for Performance Optimization in Semiconductor Manufacturing & Advanced Packaging

This talk will present several important applications of ML/AI in semiconductor manufacturing, advanced packaging, optical assembly, PCB assembly, and other areas in electronics manufacturing. Applications such as traceability, predictive maintenance, productivity improvement, process optimization, and yield improvement will be discussed. Various use cases will be presented to demonstrate how an ML/AI platform at the Edge can be utilized, using real-time data routinely generated by the machine, to significantly improve the machine performance as well as yield and throughput for challenging processes, including anomaly detection and predictive maintenance; adaptive control for precision epoxy dispensing, and adaptive control for precision alignment.