Arun Gowda

Arun Gowda is SiC Mission Leader and Principal Engineer at GE Research, responsible for packaging development and deployment of GE's SiC technology into applications. Prior to this role, Arun led the Electronics Packaging and Miniaturization lab at GE Research, responsible for the development of advanced packaging and integration of microelectronics, sensors, and power devices. Arun has 17 years of GE experience spanning various technical contributor, project leadership, and people management roles. He received his PhD from Binghamton University (State University of New York) with a specialization in electronics manufacturing.