The Award recognizes innovative new products moving the semiconductor manufacturing industry forward. All exhibitors are welcome to submit a nomination for their company. Winning entries are products or services that significantly impact the industry as a whole, or in a particular application. The “BEST OF WEST” award is presented by Semiconductor Digest and SEMI.
CONGRATULATIONS EV GROUP!
2024 FINALISTS
Advantest: HA1200 Die-Level Handler – Booth 1039
The new HA1200 die-level handler for the Advantest V93000 system-on-chip (SoC) tester offers die test capability with active thermal control to enable at-speed 100% test coverage before the die are assembled into 2.5D/3D packages, thus ensuring minimal loss of die yield at final test.
EV Group: EVG®880 LayerRelease – Booth 1345
The EVG®880 LayerRelease™ system is the first HVM equipment platform incorporating EVG’s innovative LayerRelease™ technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers.
Nordson TEST & INSPECTION: SpinSAM Acoustic Microscopic Imaging (AMI) System – Booth 1233
The latest product from Nordson TEST & INSPECTION is an automated inspection tool that delivers high throughput and better sensitivity for accurately locating defects in wafer-based assemblies. SpinSAM provides superior image quality and defect capture. Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.